Bump Adapters allow SMT adaptation of fine pitch devices.
Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with ½ oz copper traces on both sizes. Non-solder mask defined pads are finished with electroless nickel immersion gold.
