Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.
Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with ½ oz copper traces on both sides. Operating temperature is up to 221°F for FR4 versions and 226°F for lead-free version.