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| | Copper-Encased Vapor Chambers cool microprocessors.

Copper-Encased Vapor Chambers cool microprocessors.


NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm<sup>2</sup> while offering multidirectional thermal spreading as low as 0.02°C/W. Units can withstand clamping forces up to 90 psi and repeated exposure from -40 to +100°C.

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