Available on VME64x and VPX embedded computers, Level 300 ruggedization suits high end of market where static discharge can damage hardware deployed in harsh environments. Level 300 incorporates ESD protection using nickel electro-plated covers that protect board to meet military/aerospace requirement for 2-Level in-the-field maintenance. For benign and semi-rugged applications, Level 50 ruggedization delivers -20 to 65°C operating temperature range option.


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