Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.


Click Here to read the entire article...